Physware - 3D Fullwave Design Solutions for SI PI EMI SNI across Chip Package Board System

Home Solutions Signal Integrity (SI) Power Integrity (PI) EMI Integrity (EMI) SSN/SSO Integrity (SNI) Products PhysWAVE PhysAPEX PhysWAVE Datasheet PhysWAVE Datasheet (Japanese) PhysAPEX Datasheet PhysAPEX Datasheet (Japanese) Customers Partners Resources Application Snippets Navigating Electromagnetic Field Solvers for SI-PI-EMI Applications Advanced 3D Broadband BEM for Fast and Accurate SI-PI-EMI Solutions Removing Artificial Resonances in Cropped Structures Designing MIMO Antennas for RF Front Ends and Wireless ASICs Technical White Papers Physware's Parallelization Methodology The Interpretation of Non-Zero Mutual Resistances Enabling System-level Electrical Co-design for Mixed-Signal Systems PhysWAVE Datasheet PhysWAVE Datasheet (Japanese) PhysAPEX Datasheet PhysAPEX Datasheet (Japanese) Software & User Guides Customer Support Portal Design for Integrity Blog Media In the News Renesas Electronics Establishes Design Flow with Physware Technology Physware Expands Management Team with Addition of Global Salesforce Leading Industry Analyst Firm Selects Physware as 2010 Cool Vendor in Semiconductors Physware presents Workshop on Field Solver Solutions at ISQED Symposium 2010 EDSFair 2010 Physwareセミナー開催のお知らせ Physware Announces Seminar at EDSFair 2010 Physware joins Distinguished Speakers in Presenting at DesignCon 2010 Power Distribution Network (PDN) Simulation for Complex Flip Chip Packages Texas Instruments, Micron, Tabula and CWS to speak at Physware Booth @ DAC Early Co-Design for Mixed-Signal Systems Design of MIMO Antennas Vitesse Adopts PhysWAVE Physware: 100X speed over Physware: EMI analysis tool Serial Link Design and Analysis 3D Chip Package Board Modeling Founding Member of HSPICE Integrator Events and Tradeshows Company Management Team Software Demo Request Contact Us Privacy Policy & TOS

Chip through System 3D Broadband Solutions

3D Fullwave Design Solutions for SI PI EMI SNI across Chip Package Board System

Design for Integrity

Maxwell-Accurate True-3D, True-Parallel, High-Speed Fullwave Broadband Solutions that allow Design and Verification of your entire Chip-Package-Board systems for:

Signal Integrity (SI)

Broadband multiport crosstalk and signal propagation prediction and design

Power Integrity (PI)

Full-wave and quasi-static electrical models for power behavior prediction and design

EMI Integrity (EMI)

Near and Far field prediction for susceptibility and interference issues, compatibility and regulation modeling

SSN/SSO Integrity (SNI)

Simultaneous switching noise and combined SI - PI, PI - EMI integrity solutions

About Us

Physware is a provider of high-speed innovative 3D fullwave solutions that enable broadband verification and design across the chip - package - board ecosystems. Physware's solutions allow design and verification of entire chip-package-board systems for SI, PI, SNI and EMI.

Today, Physware helps customers solve their SI, PI, SNI and EMI challenges in a variety of design areas including microprocessors, FPGAs, memory, wireless RF systems, analog systems, and high-speed serial and parallel channels.

Featured Customers

Some of our Customers currently benefiting from Physware Solutions:

Texas Instruments

Panasonic

Toshiba

News & Events

Jun 9, 2010 - Renesas Electronics Establishes Design Flow with Physware Technology

Jun 7, 2010 - Physware Expands Management Team with Addition of Global Salesforce

May 26, 2010 - Leading Industry Analyst Firm Selects Physware as 2010 Cool Vendor in Semiconductors

Mar 23, 2010 - Physware Workshop on Field Solver Solutions at ISQED 2010