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Chip through System 3D Broadband Solutions

3D Fullwave Design Solutions for SI PI EMI SNI across Chip Package Board System

Design for Integrity

Maxwell-Accurate True-3D, True-Parallel, High-Speed Fullwave Broadband Solutions that allow Design and Verification of your entire Chip-Package-Board systems for:

Signal Integrity (SI)   

Broadband multiport crosstalk and signal propagation prediction and design

Power Integrity (PI)   

Full-wave and quasi-static electrical models for power behavior prediction and design

EMI Integrity (EMI)    

Near and Far field prediction for susceptibility and interference issues, compatibility and regulation modeling

Switching Noise Integrity (SNI)   

Simultaneous switching noise and combined SI - PI, PI - EMI integrity solutions

 

 

  

About Us 


Physware is a provider of high-speed innovative 3D fullwave solutions that enable broadband verification and design across the chip - package - board ecosystems.  Physware's solutions allow design and verification of entire chip-package-board systems for SI, PI, SNI and EMI.

Today, Physware helps customers solve their SI, PI, SNI and EMI challenges in a variety of design areas including microprocessors, FPGAs, memory, wireless RF systems, analog systems, and high-speed serial and parallel channels.

 Featured Customers


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Some of our Customers currently benefiting from Physware Solutions: 

Texas Instruments

Panasonic

Toshiba

 

News & Events 

EDSFair 2010Jan 19, 2010  - EDSFair 2010 Physwareセミナー開催のお知らせ

DesignconJan 08, 2010  - Physware joins Distinguished Speakers in Presenting at Designcon 2010

Cadence LiveOct 01, 2009  - Power Distribution Network (PDN) Simulation for Complex Flip Chip Packages

EDN JapanFeb 20, 2009- Physware’s EMI analysis tool: 100X speed over conventional tools