Validating Complex 3D Full-wave Extraction for Package-board Simulations

At Designcon 2010, engineers from Physware and industry experts discussed accurate approaches to validate complex package-board simulations. Such methodologies are critical for choosing the right tools, comparing against different approaches, and making sure the designer’s toolset contains the right extractors and simulators!  In the post-presentation discussion, there were several requests to make the methodologies open through a public forum or through an IEEE standard. These developments are in progress. Stay tuned for more on this critical topic of validation in chip-package-board environments!

4-WA2

An Accurate Methodology for Model-to-hardware Calibration and Correlation with PCB-package Simulation Using Electromagnetic Solvers.

Wednesday, February 3 | 9:20 am – 10:00 am

Dr. Souvik Mukherjee, Signal Integrity Engineer, Texas Instruments, Dr. Dipanjan Gope, Vice-President, R&D, Physware Inc., Dr. Rajen Murugan, Signal Integrity Engineer, Texas Instruments, Dr. Vikram Jandhyala, CTO, Physware Inc., Dr. Django Trombley, RF Characterization Engineer, Texas Instruments

Abstract:  This paper presents an accurate simulation, hardware development and measurement methodology to accurately characterize electrical performance metrics of packages and PCBs. This is addressed by developing a dedicated PCB and package test vehicle, measurement and simulation setup of impedance on power delivery nets and cross-coupling between a set of aggressor and victim signal nets. In order to address simulation accuracy with required efficiency, appropriate algorithms have been evaluated. Benchmarking of  different modeling techniques have been performed against measurements in order to scope applicability of commercially available EM solvers.