EMI Integrity Challenges

Electromagnetic interference issues can be global in nature, and be present anywhere in the chip-package-board ecosystem. All 3D discontinuities are potential sources of EMI and need to be modeled. EMI modeling requires high dynamic range and high accuracy in simulation in order to predict radiation due to small discrepancies in otherwise well-designed differential systems. The effect of chip interconnect and substrate noise sources need to be accounted for, and near and far fields, current densities, and current spectra need to be computed for entire systems.

Fundamental Solutions Needed

The global nature of EMI necessitates large-scale, high-dynamic range and high-accuracy electromagnetic solution. Early EMI-aware design requires high-speed solution along with variable precision modes. The field solution needs to include excitation from ports, waves, as well as from noise current sources from chip-level modeling, and outputs need to include near and far fields, current densities, voltage and current spectra, and field compliance data.

Why Physware?

Physware’s proprietary technology enables, through multilevel linear-scaling electromagnetic matrix solution technology, Maxwell-accurate full 3D broadband field solution at unprecedented speeds and capacities. Speedups of 10x or more for SI and PI, and 100x for EMI over competing 3D field solutions are observed by several of our customers.

PhysWAVE

PhysWAVE provides 3D Full-Wave EM solutions for SI, PI, EMI     
  

PhysAPEX

PhysAPEX provides accelerated netlist extraction from package to system