Electronic Design Automation EDA Software : High Speed Field Solutions : High Frequency Signal & Power Integrity : Package & Board Modeling and Design : Physware, Inc. Electronic Design Automation EDA Software : High Speed Field Solutions : High Frequency Signal & Power Integrity : Package & Board Modeling and Design : Physware, Inc.
Electronic Design Automation EDA Software : High Speed Field Solutions : High Frequency Signal & Power Integrity : Package & Board Modeling and Design : Physware, Inc.
 
 
PhysPack - think beyond the die 

Design for Integrity™ 3D Broadband Full-Wave Solutions for SI-PI-EMI in Systems-in-Package


PhysPack enables package, board, system, SiP, and SoC designers to rapidly and accurately extract S-parameter and RLC models of sub-systems, make design changes, predict EMI issues, and integrate tightly with standard design flows. PhysPack’s core technology exploits fast linear scaling boundary element methodologies to enable rapid speedups in full-wave 3D Maxwell-accuracy extraction. PhysPack’s unprecedented capacity enables modeling, design, and verification of large systems-in-package. PhysPack is designed from the ground up to exploit multicore, cluster, and hybrid computing architectures.


PhysPack is Physware’s flagship 3D, broadband, full-wave electromagnetic solver. PhysPack is built around proprietary accelerated boundary element technology that enables unprecedented speed and capacity, while preserving gold-standard Maxwell accuracy. PhysPack is built from the ground up to exploit multicore and hybrid architectures, as well as to utilize the best of fast solver technology to enable quick simulation on single or dual-core machines.

PhysPack’s integrated solution provides, in a unified interface, multiple options and features that typically are only available in multiple products. Designers can benefit from Signal Integrity, Power Integrity, and EMI features from the unified interface that exploit powerful broadband full-wave EM technology. An additional quasi-static mode enables rapid full-package model generation. PhysPack also features full package and board import capability from industry standard formats as well as multiple simulation setup and queuing options within an integrated workspace.

PhysPack’s deep IP and rich feature list enables users to choose from multiple modes and design-enabling features. Users can obtain S, Y and Z matrices for packages and boards, visualize TDR-TDT waveforms and return currents, improve designs by observing strong coupling paths and performing what-if analysis, rapidly create full-package SPICE models, place multiple packages on boards and observe electrical behavior through the integrated PhysPack system. PhysPack’s EMI option allows users to specify voltage and current sources in the system and observe near-field, far-field and EMI-EMC behavior. PhysPack integrates tightly with existing design flows for both frontend and backend integration.

 
Visit us at EPEP 2008!