Physware joins Distinguished Speakers in Presenting at
DesignCon 2010
Physware joins Distinguished Speakers in
Presenting at DesignCon 2010
Distinguished
Speakers to address challenges associated with SI, PI and EMI
SANTA CLARA, CA – January 08, 2010 – Physware, Inc., a leading provider of high-speed and high capacity 3D
electro-magnetic solutions for Signal Integrity (SI), Power Integrity (PI), Electromagnetic Interference (EMI)
Integrity and Simultaneous Noise Integrity (SNI), today announced that Physware, along with distinguished speakers
from the industry will present at DesignCon 2010 being held at the Santa Clara Convention Center, Santa Clara, CA
between February 1 to February 3, 2010.
TF-MA2 |
Tutorial
Navigating Electromagnetic Field Solvers: Designer and EDA Perspectives. Monday,
February 1 | 9:00 am - 12:00 pm
Dr. Dipanjan Gope, Vice President, R&D, Physware Inc., Dr. Vikram Jandhyala, Associate Professor, University of
Washington, Dr. Rajen Murugan, Signal Integrity Engineer, Inc., Texas Instruments, Dr. Souvik Mukherjee, Signal
Integrity Engineer, Texas Instruments.
With the significantly growing needs for Signal Integrity (SI), Power Integrity (PI), and Electromagnetic
Interference (EMI) analysis in all classes of microelectronic structures in the chip-package-board ecosystems,there
is a corresponding need for fast and accurate electromagnetic (EM) simulation. However, there is a mind-boggling
variety of available EM simulation techniques. For meaningful simulation and model generation leading to successful
designs, it is essential to match the kind of EM solver to the problem at hand. This tutorial discusses some of the
critical issues and provides initial guidance as to what solvers to use and when.
4-WA2
An Accurate Methodology for Model-to-hardware Calibration and Correlation with
PCB-package Mimulation Using Electromagnetic Solvers. Wednesday, February 3 | 9:20 am - 10:00 am
Dr. Souvik Mukherjee, Signal Integrity Engineer, Texas Instruments, Dr. Dipanjan Gope, Vice-President, R&D,
Physware Inc., Dr. Rajen Murugan, Signal Integrity Engineer, Texas Instruments., Dr. Vikram Jandhyala, CTO,
Physware Inc., Dr. Django Trombley, RF Characterization Engineer, Texas Instruments
This paper presents an accurate simulation, hardware development and measurement methodology to accurately
characterize electrical performance metrics of packages and PCBs. This is addressed by developing a dedicated PCB
and package test vehicle, measurement and simulation setup of impedance on power delivery nets and cross-coupling
between a set of aggressor and victim signal nets. In order to address simulation accuracy with required
efficiency, appropriate algorithms have been evaluated. Benchmarking of different modeling techniques have
been performed against measurements in order to scope applicability of commercially available EM solvers.
11-TA4
Building IC-Package-PCB System EMI/EMC Verification and Early Design Flows:
Challenges and Methods. Tuesday, February 2 | 11:05 am - 11:45 am
Dr. Rajen Murugan, Signal Integrity Engineer, Texas Instruments, Dr. Swagato Chakraborty, Vice President of
Products, Physware Inc., Dr. Souvik Mukherjee, Signal Integrity Engineer, Texas Instruments Dr. Dipanjan Gope, Vice
President, R&D, Physware Inc., Dr. Vikram Jandhyala, Founder, Physware Inc. & Associate Professor Univ. of
Washington
Package and PCB-system aware IC co-design and verification entails early awareness of signal integrity, power
integrity, timing, and electromagnetic interference (EMI) impact on designs functionality and performance. Higher
frequencies, along with stringent EMC regulations, are driving the need for developing EMI-aware design
methodologies in the earlier and sign-off phases of the design cycle. . This paper discusses the significant
challenges of scale, connectivity, turnaround time, and accuracy needed in developing such a flow. In particular,
the numerical effect of violating established EMI guidelines is quantified in the flow, enabling cutting-edge
designs that are less conservative and still satisfy EMI constraints.
About Physware:
Physware, Inc. provides high-speed and high-capacity 3D electromagnetic signal integrity,
power integrity and EMI analysis field solutions for the microelectronics industry. The company’s patent-pending, physics-aware technology tightly couples analysis and design
methods to the underlying Maxwell’s and circuit equations, enabling robustness and efficiency at every step of
the design cycle across the entire chip-package-board system and significantly reduces time to
market. Physware’s accelerated technology delivers
unprecedented capacity
handling, significantly faster speed than current
methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising
Maxwell accuracy.
Physware is a venture-backed, privately-held company led by an experienced management team.
The technology is based on multiple patent-pending methodologies, over one hundred publications and several PhD
theses. For additional information, please visit www.physware.com.
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Media Contact:
Bala Vishwanath,
Physware, Inc., 425-458-0597, media@physware.com
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