Physware presents Workshop on Field Solver Solutions at ISQED 2010

Physware presents Workshop at ISQED Symposium 2010

Field Solver Solutions for System Level and RF

San Jose, CA – March 23, 2010 – Physware, Inc., a leading provider of high-speed and high capacity 3D electro-magnetic solutions for Signal Integrity (SI), Power Integrity (PI), Electromagnetic Interference (EMI) Integrity and SSN/SSO Integrity (SNI), today announced that the company will present Tutorial/Workshop on Field Solver Solutions for System Level & RF at ISQED Symposium 2010 being held at the DoubleTree Hotel in San Jose, CA between March 22-24, 2010.

Field Solver Solutions for System Level and RF

Session 4C

Wednesday March 24, 2010

10:30am–12 Noon

Room: Santa Clara

Dr. Dipanjan Gope, Vice President of Research and Development, Physware
Dr. Swagato Chakraborty, Vice President of Products, Physware
Professor Vikram Jandhyala, Director, Applied Computational Engineering Lab, University of Washington, Seattle

This tutorial will focus on challenges related to electromagnetic-aware design in emerging 3D scenarios. Broadband simulation, full-wave 3D extraction challenges, package-aware chip I/O design, power distribution network design, system-level signal and power integrity, simultaneous switching noise, and high-speed channel design are the critical applications addressed by the approaches in this tutorial. The tutorial will discuss simulation methodologies with particular emphasis on system-level simulation and RF effects, benefits and limitations, prescriptions for rapid design, the underlying theory of electromagnetic-circuit co-simulation, and provide an understanding of how to navigate the field solver space. The tutorial also discusses the challenges associated with field-aware design of SIP, SOC, POP, stacked die, and MCM configurations, and also introduces the emerging 3DIC scenario.

About Physware:
 
Physware is a leading provider of field solutions for signal integrity (SI), power integrity (PI), simultaneous switching (SSN/SSO), and electromagnetic interference (EMI) mitigation, for chip-package-board system challenges. Physware’s solutions, today, are helping customers worldwide tackle these issues in complex system-in-package (SiP), stacked-die, multi-chip-module (MCM), and system-on-chip (SoC) scenarios with applications in wireless, memory, microprocessor, FPGA, high-speed-channels and backplanes.
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Physware is a venture-backed, privately-held company led by an experienced management team. The technology is based on multiple patented and patent-pending methodologies, over one hundred publications and several PhD theses. For additional information, please visit www.physware.com.

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Media Contact:

Janani Swaminathan, Physware, Inc., 425-458-0597, media@physware.com

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