Power Distribution Network (PDN) Simulation for Complex
Flip Chip Packages
Power Distribution Network (PDN) Simulation for Complex Flip Chip
Packages
Tabula and Physware
to present at Cadence Live Silicon Valley 2009 Event
SAN JOSE, CA – Oct 01, 2009 – Physware, Inc., a provider of
high-speed and high capacity 3D electro-magnetic solutions for Signal Integrity (SI), Power Integrity (PI),
Electromagnetic Interference (EMI) Integrity and Simultaneous Noise Integrity (SNI), today announced that
distinguished speaker from Tabula will join executives from Physware in presenting the challenges and solutions
faced in Power Distribution Network (PDN) Simulation for Complex Flip Chip Packages at the Cadence Live Silicon Valley 2009 event on October
05, 2009.
Abstract: Modern programmable logic chips packages provide multiple
hundreds of user I/Os switching at 100s of MHz. More advanced devices include dozens of SerDes channels with
switching speeds in the multi-gigabit ranges. The situation is further exacerbated by the presence of multiple
I/O power rails and high current density core logic. This creates enormous challenges, in designing robust power
delivery networks (PDN), on the package. The common metrics for a robust PDN include low impedance and immunity
to simultaneous switching output noise. Managing this design complexity requires access to modeling tools that
offer the ability to extract and analyze complex 3D structures and provide accurate answers. This session will
demonstrate, through a test package, excellent simulation to measurement correlation of various PDN structures.
Full-wave electromagnetic solution has been widely used to characterize the PDN.
However, due to the ever-increasing complexity of the PDN, the prior EM techniques are
all based on approximation by either assuming TEM wave propagation within power/ground planes or geometrical
segmentation. On the other hand, Physware PhysWAVE uses 3D full-wave accelerated boundary element techniques
and, as will be shown, provides accurate and scalable solution for PDN characterization from DC to high
frequencies in a single efficient and accurate scalable solver. In terms of tool flow, Allegro Package Designer
(APD) is employed for package layout generation. The .mcm file is directly imported to PhysWAVE. The desired
power net, which can be either core or I/O, can be extracted and simulated. Ports are defined between the bump
or BGA ball pin and the ground pin, which matches the measurement setup. PhysWAVE outputs S-parameters covering
the desired frequency range. Having achieved satisfactory calibration of the tools, the methodology is
established to improve the PDN structures through design optimization and to use the tools to predict
performance through simulations.
It is expected that such a full-wave 3D tool flow, for the first time based on a rigorous
3d EM full-wave solver, will become necessary across many designs in the space of broadband PDN analysis and
design for complex-chip packages.
Take Aways:
Presenter(s):
- Suresh Subramanian (Tabula)
- Bala Vishwanath, Swagato Chakraborty, Dipanjan Gope, & Vikram Jandhyala
(Physware)
Registration: http://www.secure-register.net/cadence/cdnlive_sj_sip_1005_track4
About Physware:
Physware, Inc. provides high-speed and high-capacity 3D electromagnetic signal integrity,
power integrity and EMI analysis field solutions for the microelectronics industry. The company’s patent-pending,
physics-aware technology tightly couples analysis and design methods to the underlying Maxwell’s and circuit
equations, enabling robustness and efficiency at every step of the design cycle across the entire
chip-package-board system and significantly reduces time to market. Physware’s accelerated
technology delivers unprecedented capacity handling,
significantly faster speed
than current methodologies, and the ability to span the entire design cycle
while maintaining concurrent, uncompromising Maxwell accuracy.
Physware is a venture-backed, privately-held company led by an experienced
management team. The technology is based on multiple patent-pending methodologies and industry publications. For
additional information, please visit www.physware.com .
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Media Contact:
Bala Vishwanath,
Physware, Inc., 425-458-0597, media@physware.com
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