What's innovative about Physware's Technology?

Physware’s proprietary PhysBEAM technology enables, through multilevel linear-scaling electromagnetic matrix solution technology, Maxwell-accurate 3D fullwave design solutions for SI PI EMI and SNI challenges at unprecedented speeds and capacities. Speedups of 10x or more for SI and PI, and 100x for EMI and SNI over competing 3D field solutions are observed by our customers. Additionally, Physware technology enables design solutions that have traditionally not been possible and allows for significantly larger chip-package-board-system constituents to be analyzed, therefore reducing turnaround time and removing errors associated with ad hoc “pizza slicing” of designs. PhysBEAM is built from the ground up to algorithmically exploit at the electromagnetic matrix solver level, multicore shared-memory architectures, thus enabling dramatic speedups without memory overheads, unlike distributed-mode field solvers, on multiple cores. PhysBEAM also allows direct incorporation of circuit elements into the electromagnetic simulation, thereby enabling co-design and co-simulation in the presence of passive elements.

Signal Integrity

 Power Integrity

 EMI Integrity

 Switching Noise Integrity

SI necessitates broadband analysis from DC upto multi-GHz frequencies.

At those high-frequencies, full-wave electromagnetic effects are critical in effecting phase and propagation.

Crosstalk and through-transmission prediction require a high-dynamic range simulation capability, and global coupling, large return paths, and novel cust-cutting system designs necessitate large-scale 3D electromagnetic simulation and speeds that can enable multiple design iterations.

High-speed power transients imply that PI requires broadband DC to multi-GHZ analysis for complete steady-state, transient, aned harmonic simulation. Impedance profiles built from these solutions need to be flexible, accurate, and complete.

Reduced-cost packages and systems imply that complex 3D effects are the norm, necessitating large-scale high-speed 3D simulation to capture all dominant coupling effects. The simulation needs to be sufficient accurate to represent appropriately all coupling effects in the time domain through the generation of accurate, error-controllable SPICE models.

Electromagnetic interference issues can be global in nature, and be present anywhere in the chip-package-board ecosystem. All 3D discontinuities are potential sources of EMI and need to be modeled.

EMI modeling requires high dynamic range and high accuracy in simulation in order to predict radiation due to small discrepancies in otherwise well-designed differential systems. The effect of chip interconnect and substrate noise sources need to be accounted for, and near and far fields, current densities, and current spectra need to be computed for entire systems.

Switching noise integrity requires the combined simulation and modeling of multiple noise effects. 

Combined power and signal integrity is necessitated in simultaneous switch noise (SSN) and simultaneous switching output (SSO).

Combined EMI and power integrity is required for early EMI prediction and mitigation.

SNI in general requires high dynamic range and high accuracy, complete system-level electrical simulation, and sufficient modeling and simulation speed to enable multiple design passes with user feedback.