Texas Instruments, Micron, Tabula & CWS to speak at Physware Booth @ DAC

Physware Announces Distinguished Speaker Series 

Texas Instruments, Micron, Tabula and CWS to speak at Physware Booth #1814 at DAC  

Distinguished Speakers to address challenges associated with SI, PI and EMI

SAN FRANSISCO, CA – July 24, 2009 – Physware, Inc., a provider of high-speed and high capacity 3D electro-magnetic solutions for Signal Integrity (SI), Power Integrity (PI), Electromagnetic Interference (EMI) Integrity and Simultaneous Noise Integrity (SNI), today announced that distinguished speakers from Texas Instruments, Micron, Tabula, CWS and other companies will speak at Physware Booth #1814 at Design Automation Conference being held in the Moscone Center in San Fransisco between July 27th – July 30th, 2009.

Industry leading companies will present their challenges associated with today’s complex SI, PI and EMI designs and also provide recommendations on how to tackle the same.  Specific topics related to PDN simulation of complex flip chip packages, modeling challenges for stacked die packages to enabling early co-design for mixed signal systems and challenges in system-level SI and PI analyses will be presented and discussed in detail by distinguished members from Texas Instruments, Tabula, CWS and Micron Technology.

Executives from Physware will also present challenges and solutions associated with high-speed channel modeling, parametric simulations, advances in 3D boundary element methods, EMI and Antenna simulations, Memory RDL layer and Analog/RF passive modeling, Simultaneous Switching Noise (SSN / SSO) design and Channel simulation techniques.  In addition, Physware will showcase a demo of soon to be released product, PhysVOLT, a static and dynamic IR drop simulation tool.

Detailed speaker schedule can be viewed by visiting DAC Distinguished Speaker Seminar Series.  

About Physware:

Physware, Inc. provides high-speed and high-capacity 3D electromagnetic signal integrity, power integrity and EMI analysis field solutions for the microelectronics industry.   The company’s patent-pending, physics-aware technology tightly couples analysis and design methods to the underlying Maxwell’s and circuit equations, enabling robustness and efficiency at every step of the design cycle across the entire chip-package-board system and significantly reduces time to market.   Physware’s accelerated technology delivers unprecedented  capacity  handling, significantly faster speed  than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy. 

             Physware is a venture-backed, privately-held company led by an experienced management team. The technology is based on multiple patent-pending methodologies, over one hundred publications and several PhD theses. For additional information, please visit www.physware.com   .

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Media Contact: 

Bala Vishwanath, Physware, Inc., 425-458-0597, media@physware.com   

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